Resin molding and secondary processing line
A low clamping force type injection molding system using surface-level positioning finishing technology!
The "low clamping force type injection molding system" is a low-pressure compression molding method that intentionally incorporates an overflow section (flash). With injection molding technology and surface finishing technology, automation and unmanned operation of resin molding and secondary processing lines are possible. This allows for significant cost reductions in high-precision, high-quality resin molded products with large areas and thin walls. Additionally, the shear stress during cavity filling is low, and pressure is applied uniformly, resulting in minimal molding distortion. 【Features】 ■ Supply pressure: 1/2 to 1/5 ■ Clamping pressure: 1/3 to 1/10 ■ Minimal deformation allows for thin-walling, with PC at 0.8mm (especially for large and thin items) ■ No gas burn or PL flash ■ Energy consumption reduced to 1/3 *For more details, please refer to the PDF document or feel free to contact us.
- Company：NSK CO., LTD.
- Price：Other
